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IEC 61191-4:2017 Part 4: Requirements for terminal soldered assemblies

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发表于 2017-8-12 17:08:04 | 显示全部楼层 |阅读模式
IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61191-4:2017(E) prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related technologies (i.e. surface mounting, through-hole mounting, chip mounting).
This edition includes the following significant technical changes with respect to the previous edition:
The requirements have been updated to be compliant with the acceptance criteria in IPC?A-610F.

Publication type        International Standard
Publication date        2017-07-26
Edition        2.0
Available language(s)        English
TC/SC        TC 91 - Electronics assembly technologyrss
ICS        31.240 - Mechanical structures for electronic equipment
Stability date          2024
Pages        19
File size        1612 KB
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